Organization index / public roles

Industry and ecosystem map

The ecosystem is still compact. This map distinguishes specification owners and participants from vendors pursuing technically adjacent fast-flash products.

SD

Originator + supplier

Sandisk

Introduced HBF publicly in February 2025 and co-leads the OCP specification effort.
SK

Supplier + co-standardizer

SK hynix

Positions HBF as AIN-B in its AI-NAND strategy and co-authors the standards work.
OCP

Standards venue

Open Compute Project

Hosts the HBF workstream, currently listed in its semi-private workstream directory.
G/T

Workstream participants

Google + Tenstorrent

Named in the August 2026 announcement as participants in the initial technical specification work.
KX

Adjacent flash path

Kioxia

Develops high-bandwidth PCIe flash modules and GPU-direct SSD products, not announced OCP HBF devices.
UC

Interface ecosystem

UCIe Consortium

Maintains the chiplet interconnect named as HBF's host-facing link.

Core HBF activity / 01

Core HBF records

IndustryCore HBF

High Bandwidth Flash enters the public roadmap

Sandisk's investor presentation introduced HBF as a vertically integrated, capacity-oriented memory tier for AI inference and set out the earliest public product roadmap located by this project.

Date
11 Feb 2025
Evidence
Primary source
Source
Sandisk

Adjacent paths / 02

Adjacent technology records

These sources illuminate alternative interfaces, packages, and software data paths. The catalog intentionally does not rename them HBF.

StandardsAdjacent technology

UCIe 3.0 doubles die-to-die data rates

UCIe 3.0 adds 48 and 64 GT/s operation plus manageability and system-in-package improvements for interoperable chiplets.

Date
5 Aug 2025
Evidence
Primary source
Source
UCIe Consortium