Public record / 2025—present

Chronology of High Bandwidth Flash

The public HBF record is young. This timeline follows the sequence of announcements, standards work, prototypes, and research—without treating them as the same kind of evidence.

2026
ResearchPreprint

A full-stack study draws a sharp boundary around HBF

The study argues that HBF performs poorly as a drop-in SSD replacement for transient KV-cache traffic, while identifying selective, more read-oriented uses where it can remain valuable.

arXiv
StandardsPrimary source

The first HBF specification package is announced

The companies announced an initial OCP HBF specification covering stack capacities up to 512 GB, three bandwidth grades, a UCIe host link, packaging and reliability, and software I/O guidance.

Sandisk + SK hynix
ResearchPeer reviewed

A custom base die pools HBM and HBF capacity

A system proposal for pooling HBM and HBF behind a custom logic die to support terabyte-scale inference memory footprints.

IEEE Computer Architecture Letters
StandardsPrimary source

The OCP HBF workstream formally begins

The companies announced the start of an Open Compute Project workstream to define a common HBF architecture and interface.

Sandisk + SK hynix
ResearchPeer reviewed

A broader map of the LLM inference memory problem

A survey and research agenda for inference hardware that situates emerging memory tiers, including HBF, inside the wider model-serving bottleneck.

IEEE Computer / arXiv
ResearchPeer reviewed

H³ models a hybrid HBM–HBF inference system

The paper evaluates a heterogeneous HBM-HBF design for serving large language models under memory-capacity and cost constraints.

IEEE Computer Architecture Letters
2025
StandardsPrimary source

Sandisk and SK hynix align on HBF standardization

The companies announced an agreement to define interoperable HBF specifications and build a broader ecosystem around high-capacity, high-bandwidth flash memory.

Sandisk + SK hynix
StandardsPrimary source

UCIe 3.0 doubles die-to-die data rates

UCIe 3.0 adds 48 and 64 GT/s operation plus manageability and system-in-package improvements for interoperable chiplets.

UCIe Consortium
IndustryPrimary source

The first compact public HBF architecture brief

A two-page overview of the HBF concept, its proposed system role, projected stack organization, and comparison with conventional high-bandwidth memory.

Sandisk
IndustryPrimary source

High Bandwidth Flash enters the public roadmap

Sandisk's investor presentation introduced HBF as a vertically integrated, capacity-oriented memory tier for AI inference and set out the earliest public product roadmap located by this project.

Sandisk